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Leland "Chip" Spangler, Ph.D.

Aspen Microsystems LLC
Dr. Spangler is the President of Aspen Microsystems, LLC, a product design, development and consulting company that provides engineering services for advanced MEMS and microelectronic devices, with specialties in semiconductor packaging and assembly technologies. Aspen Microsystems also provides technical assistance with Intellectual property, reliability and failure analysis, manufacturing and quality operating systems.

Previously Chip was the President and CTO of Aspen Technologies, a microelectronic package and assembly service supplier. He was responsible for developing package solutions for extremely high-pixel count displays, DNA analysis products, MEMS telecom switch arrays, microfluidic devices, optical and RF MEMS, pressure and inertial sensors as well as a variety of other MEMS and integrated circuit devices. Prior to Aspen Technologies, Chip worked at Intel and Ford Microelectronics where his responsibilities ranged from pressure sensors, and airbag and chassis accelerometers to custom analog and mixed-signal ASICs. His work lead directly to the production of the world’s first wafer-level packaged surface-mount airbag accelerometer.  

Dr. Spangler received his Ph.D. in electrical engineering from The University of Michigan in 1988. He is the author of over 30 technical publications and has 10 patents. He is currently an editor for IEEE JMEMS and has helped organize Hilton Head, Transducers Conference, SPIE, IEEE MEMS Conference and regularly teaches classes on a variety of MEMS and semiconductor topics.