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Michael Clay

Intel Corporation
Global Lead for Sensors and Connectivity
Michael Clay is the global lead for Sensors and Connectivity for Intel Internet Of Things Group in the Market and Channel Acceleration division. In this role Michael is responsible driving new partnerships with Sensor vendors globally that enable use cases across all vertical markets and integrate with Intel Architecture. He is also responsible for managing 3rd party relationships with connectivity providers that are part of the Intel roadmap and/or provide transport modules, components, and SW for Industrial Internet Of Thing solutions across vertical markets. Michael joins Intel after several years managing his own startup focused on Wireless Consulting. He managed Strategic Partnerships for Verizon Wireless Connected Devices as an original member of the Open Development Team. Michael also led Sales Teams for Enterprise Solutions with Alcatel Lucent focused on AT&T and Verizon Communications.